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Professional headshot of Wen Li

Wen Li

Professor

Electrical and Computer Engineering (ECE), College of Engineering

775 Woodlot Dr Rm 1042

Biography

Wen Li received her Ph.D. degree (2009) and M.S. degree (2004) in Electrical Engineering from California Institute of Technology. Before that, she studied in Tsinghua University and received her M.S. degree in Microelectronics (2003) and B.S. degree in Material Science and Engineering (2001). Her research interests include MEMS/NEMS technologies and systems, micro sensors and actuators, biomimetic ... devices and systems, microfluidic and lab-on-chip systems, and microsystem integration and packaging technologies.

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Education

Ph.D., California Institute of Technology, 2009

M.S., California Institute of Technology, 2004

M.E., Tsinghua University, Beijing, China, 2003

B.E., Tsinghua University, Beijing, China, 2001

Awards

Withrow Teaching Excellence, College of Engineering, Michigan State University, May, 2021

Global Fellowship, Michigan State University, Dec. 2013- Dec. 2014

Best Paper Award, Neurotechnology Consortium Workshop, IEEE EMBC 2013,Japan,July 03, 2013

Best Student Paper Award, 2012IEEE Biomedical Circuits and Systems Conference (IEEE BioCAS 2012), Hsinchu, Taiwan, Nov. 28-30, 2012

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Publications

Weiyang Yang, Qi Hua Fan, Zhen Qiu, Arthur Weber and Wen Li, "A fully transparent, flexible μECoG array based on highly conductive and anti-reflective PEDOT:PSS-ITO-Ag-ITO thin films".

Lab on a Chip 21, no. 6 (2021): 1096-1108.

Bin Fan, Cory A. Rusinek, Cort H. Thompson, Monica Setien, Yue Guo, Robert Rechenberg, Yan Gong, Arthur J. Weber, Michael F. Becker, Erin Purcell, and Wen Li, "Flexible, Diamond-based Microelectrodes Fabricated Using the Diamond Growth Side for Neural Sensing." Microsystems & Nanoengineering, 6, no.1 (2020): 1-12.

M. Hossein M. Kouhani, Jiajia Wu, Arman Tavakoli, Arthur Weber, and Wen Li, "Wireless, Passive Strain Sensor in a Doughnut-Shaped Contact Lens for Continuous Non-invasive Self-monitoring of Intraocular Pressure." Lab on a Chip, 20 (2020): 332 - 342.

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